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Method of providing support to land-side decoupling capacitors for an electronic package assembly

IP.com Disclosure Number: IPCOM000008064D
Publication Date: 2002-May-15
Document File: 2 page(s) / 28K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method of providing support to land-side decoupling capacitors for an electronic package assembly. Benefits include improved reliability, improved power delivery, and simplified manufacturing process.

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Method of providing support to land-side decoupling capacitors for an electronic package assembly

Disclosed is a method of providing support to land-side decoupling capacitors for an electronic package assembly. Benefits include improved reliability, improved power delivery, and simplified manufacturing process.

Background

      Land-side capacitors (LSCs) require support to prevent damage to both the motherboard and the capacitors in case of contact.

              In a conventional flip-chip ball grid array (FC-BGA) package, the die is a flip-chip attached to a substrate/package. The decoupling capacitors are placed on the die side and are low profile (~0.6 mm, maximum) and low capacitance (0.68 µF). LSCs cannot be placed because the solder ball height is approximately 0.7 mm, whereas the LSCs are typically 1 mm after attachment. The package is shipped to another equipment manufacturer (OEM) that mounts the package on the motherboard (see Figure 1).

              In other conventional solutions, the use of LSCs as stand-off has been discussed which enables package layer count reduction, better power delivery, elimination of the die-side capacitors (DSCs), and eventually reduced cost (Figure 2). However, the use of LSCs as stand offs has a potential disadvantage of damaging the motherboard top layer circuitry during shipment/transportation stages.

General description

              The disclosed method provides support to land-side decoupling capacitors to a surface-mount electronic package assembly to avoid damage to the...