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Method for the direct solder attachment of two or more printed circuit boards without a connector using top-side soldering

IP.com Disclosure Number: IPCOM000008067D
Publication Date: 2002-May-15
Document File: 2 page(s) / 57K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the direct solder attachment of two or more printed circuit boards without a connector using top-side soldering. Benefits include improved reliability, improved speed, and improved impedance.

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Method for the direct solder attachment of two or more printed circuit boards without a connector using top-side soldering

Disclosed is a method for the direct solder attachment of two or more printed circuit boards without a connector using top-side soldering. Benefits include improved reliability, improved speed, and improved impedance.

Background

              Market demands require packaging options to reduce the size and volume of circuit assemblies. Conventional industry practice is to create multiple circuit boards and mate them together using connectors, which are soldered to the board. The connectors add cost to the product and are the source of quality/reliability penalties. Typically, a female connector is solder attached to one circuit board. The second circuit board has edge contacts, which are inserted into the female connector.

Description

              The disclosed method is the direct solder attachment of two or more printed circuit boards without a connector (see Figure 1). The key elements of the method include:

§         Direct solder attachment of two or more circuit boards

§         No connector

§         Top-side reflow or manual soldering

§         No slot in the board, which enables full signal routing

§         Alignment between boards through an alignment hole and retention features

§         Alignment hole that may be plated and subsequently soldered for power delivery or ground return

§         Main board and daughter card with matching pad configurations

§         Pads that are conventional, VIP, or VBP

§         Multiple pads that can be gro...