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INCREASING THE USEABLE TRACKING AREA ON FLEXIBLE SUBSTRATE DESIGNS

IP.com Disclosure Number: IPCOM000008192D
Original Publication Date: 1997-Jun-01
Included in the Prior Art Database: 2002-May-24
Document File: 1 page(s) / 53K

Publishing Venue

Motorola

Related People

David Willis: AUTHOR

Abstract

When using a "flexible" substrate with separately rigidised regions which are"folded up" after compo- nent placement and soldering, the bottleneck for copper track routing can often be between adjacent folded-up sections. This is especially true where a connector is soldered to one of the folded rigidised sections, and input or output circuits are placed onto the adjacent folded up section. Routing the tracks via the main rigidised section will effectively reduce the available substrate area (for component placement and tracking). A typical substrate outline is shown in Figure 1, with the rigidised sections cross-hatched. When folded-up, this would look like Figure 2.

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MOTOROLA Technical Developments

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INCREASING THE USEABLE TRACKING AREA ON FLEXIBLE SUBSTRATE DESIGNS

by David Willis

  When using a "flexible" substrate with separately rigidised regions which are"folded up" after compo- nent placement and soldering, the bottleneck for copper track routing can often be between adjacent folded-up sections. This is especially true where a connector is soldered to one of the folded rigidised sections, and input or output circuits are placed onto the adjacent folded up section. Routing the tracks via the main rigidised section will effectively reduce the available substrate area (for component placement and tracking). A typical substrate outline is shown in Figure 1, with the rigidised sections cross-hatched. When folded-up, this would look like Figure 2.

  A potential solution to this problem is to use the "comer" pieces of the substrate to increase the useable tracking area. If the substrate is shaped as shown in Figure 3, with the comer sections (marked 'X') shaped as shown, these additional areas of substrate can be used for copper tracks between adjacent rigidised sections. Since the "corner" sections are traditionally removed anyway, this should not incur any increase in substrate cost. When the rigidised substrate sections are folded up, the comer pieces are flexed inwards (Figure 4) so as not to interfere with subsequent assembly processes.

0 Maaok, Inc. 1997 102 June I997

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