Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

HYDRAULIC PAD CONDITIONING

IP.com Disclosure Number: IPCOM000008233D
Original Publication Date: 1997-Sep-01
Included in the Prior Art Database: 2002-May-29
Document File: 3 page(s) / 120K

Publishing Venue

Motorola

Related People

Todd Buley: AUTHOR [+2]

Abstract

In this work., we review the current methods of pad conditioning used with Chemical Mechanical Polishing (CMP) tools and then describe hydraulic pad conditioning. The apparatus and methodology presented herein regarding hydraulic pad conditioning are applicable to all polishing tools from any of the recognized suppliers of this type of equipment.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Page 1 of 3

MO7-OROLA Technical Developments

@

HYDRAULIC PAD CONDITIONING

by Todd Buley and James Vanell

ABSTRACT

  In this work., we review the current methods of pad conditioning used with Chemical Mechanical Polishing (CMP) tools and then describe hydraulic pad conditioning. The apparatus and methodology presented herein regarding hydraulic pad conditioning are applicable to all polishing tools from any of the recognized suppliers of this type of equipment.

STATEMENT OF PROBLEM

  Chemical Mechanical Polishing (CMP) technology utilizes a slurry-wetted pad mounted on a rotating circular or translating belt surface against which is pressed the processed face of a wafer. The combination of slurry, rotation or translation speed, temperature, and pressure causes the wafer surface to be polished i,o a high degree of flatness. Crucial to this process is the surface condition of the pad, the efftciency o:f slurry transport, and the removal of by-products. The effects of these three parameters can be measured by removal rate and uniformity, the degree of flatness of the surface of the wafer, and the polish pad useful lifetime.

  The surface condition and sluny transport efft- ciency of the pad are currently controlled by a process called pad conditioning which involves physically abrading the pad to obtain the required surface condition.

  Current methods of pad conditioning include the use of abrasives, typically diamonds, set in a nickel matrix mounted on rotating/translating pads, knife-edged rotating rings, or with brushes mounted on rotating/translating pads. These methods have the following disadvantages:

* Wafer scratching due to abrasives breaking free of the nickel matrix

0 hmomla. Inc. ,997 6

Wafer scratching due to agglomerated slurry parti- cles breaking free from the pad conditioning mechanism

l

l

Contamination due to brush bristles breaking free

Metallic contamination of the process due to corrosion of the nickel matrix

l

Waste product accumulation on/in the pad condi- tioning mechanism

l

Difficulty of reliable downforce control and measurement

l

Uneven wear patterns on the pad due to the abrasion mechanism

SOLUTION TO THE PROBLEM

  The hydraulic pad conditioning system of the present invention utilizes a high velocity stream of fluid directed onto the polishing pad to effect positive changes in slurry transport efficiency, surface condition changes to promote efficient...