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Method for a skyscraper heat pipe heatsink

IP.com Disclosure Number: IPCOM000008239D
Publication Date: 2002-May-29
Document File: 2 page(s) / 80K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a skyscraper heat pipe heatsink. Benefits include improved thermal performance.

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Method for a skyscraper heat pipe heatsink

Disclosed is a method for a skyscraper heat pipe heatsink. Benefits include improved thermal performance.

Background

              Most conventional heatsinks have heat pipes because of their ability to spread heat in the base. Other designs include fins for moving air. Thick fins limit the amount of exposed surface area in a given volume. The low fin efficiency of tall, thin fins limits volumetric efficiency.

Description

              The disclosed method is composed of cylindrical heat pipes, a solid metal base, and a stack of thin metal fins. The disclosed method is a thermal management device for computers that attaches to the processor within the chassis. The device operates by absorbing energy from the processor into the base where it is distributed to the heat pipes. The heat pipes transmit the energy by two-phase heat transfer to the fins where the fluid condenses, and the energy is transferred by conduction into the fins.

Advantages

              The disclosed method provides advantages, including:

·        Improved thermal performance over conventional heatsinks

·        Increased heat transfer surface area

·        Decreased pressure drop across the heatsink

·        Improved use of the volume above the processor

·        Improved uniform heat distribution along the height of the fin stack due to the condensation properties of the fluid within the heat pipe

·        Reduced design complexity

·        Improved cost effectiveness

Detailed description

              The disclosed method provides a means to effectively utilize thin fins and create tall heatsinks. Thin fins are advantageous due to increased heat transfer surface area a...