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Method for localized immersion cooling

IP.com Disclosure Number: IPCOM000008376D
Publication Date: 2002-Jun-11
Document File: 3 page(s) / 113K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for localized immersion cooling. Benefits include improved thermal performance.

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Method for localized immersion cooling

Disclosed is a method for localized immersion cooling. Benefits include improved thermal performance.

Description

      The disclosed method has the following key elements (see Figures 1 and 2):

·        Dedicated immersion cooling using perfluorinated liquid for specific circuit board locations.

·        Area of hot component(s) isolated from rest of board by thin metal enclosure soldered to circuit board.

·        Inlet/outlet tubes connect board enclosure to a backplane-mounted manifold via blind quick disconnects that connect/disconnect simultaneously with electrical connection.

·        Remote chiller provides heat transfer to air and recirculation pump.

Advantages

              The disclosed method provides advantages, including:

·        Highly effective heat transfer design for very high dissipation devices where conventional liquid cooling is not cost justified but standard air-mover technology cannot meet requirements.

·        Can be used in conjunction with standard air movers in a hybrid configuration.

·        Site-specific immersion cooling applies maximum cooling effectiveness to those components that need it, keeping costs in line with benefits.

·        Avoids increasing vertical height to be the thermal solution, improving rack density.

Fig. 1

Fig. 2

Disclosed anonymously