Browse Prior Art Database

Method for a low-cost substrate/package using an AlOx core, imprinted build-up layers, and surface mounted pins for power delivery

IP.com Disclosure Number: IPCOM000008384D
Publication Date: 2002-Jun-11
Document File: 4 page(s) / 72K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a low-cost substrate/package using an AlOx core, imprinted build-up layers, and surface mounted pins for power delivery. Benefits include improved performance and improved cost effectiveness.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Method for a low-cost substrate/package using an AlOx core, imprinted build-up layers, and surface mounted pins for power delivery

Disclosed is a method for a low-cost substrate/package using an AlOx core, imprinted build-up layers, and surface mounted pins for power delivery. Benefits include improved performance and improved cost effectiveness.

Background

              Conventionally, fabricating low-cost multilayer substrates to meet performance requirements for high-power delivery has been problematic. Examples of requirements include:

·        Power

·        Signal integrity

·        Inductance requirements

·        Signal rise time and propagation speed requirements

·        Cost effectiveness

·        Plated through holes and vias without drilling

·        Performance

·        Reduced overall package size

·        Current-carrying requirements for package attributes, such as supplying different voltage to different areas of the semiconductor device

·        Reliability requirements associated with power delivery components attached and/or in contact with silicon, ceramic and/or organic materials

·        Mechanical property requirements for substrates

              A number of variations on the conventional method exist. The basic, conventional process for organic substrates is as follows. The process for ceramic and other materials is similar.

·        Core process:

1.      Laminate copper to sheets of organic material to form the core raw material.

2.      Drill vias.

3.      Electroless and electrolytic plating to achieve required copper thickness in via.

4.      Apply photo resist material to the copper.

5.      Expose the pattern on copper using a photo tool.

6.      Develop the resist material.

7.      Etch the pattern on copper.

8.      Strip the resist material.

9.      Fill vias, planarize, and add a copper plated cap to vias.

·        Build up process:

1.      Apply the first build-up layer material to core.

2.      Semi-cure the first build-up layer material.

3.      Form vias in the build-up layer material using laser drill or photo via processes and

1.      clean the vias and exposed copper surfaces.

4.      Plate with copper to metalize the vias and form copper on the top surface of the first build-up layer.

5.      Develop, etch, and strip to form traces/spaces on the surface of the build-up layer.

6.      Repeat until all build-up layers are formed.

7.      Apply the solder mask.

8.      Develop and etch the solder mask.

General description

              The disclosed method is a design to fabricate a low-cost and high-performance substrate/package. Imprinted build-up layers are combined with an AlOx core and surface mounted pins for power delivery.

      The key elements include:

·        Use of AlOx manufac...