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Method for a unified thermal mechanical heatsink

IP.com Disclosure Number: IPCOM000008389D
Publication Date: 2002-Jun-11
Document File: 3 page(s) / 93K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a unified thermal mechanical heatsink. Benefits include simplified manufacturability.

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Method for a unified thermal mechanical heatsink

Disclosed is a method for a unified thermal mechanical heatsink. Benefits include simplified manufacturability.

Background

Conventional solutions include a three-part system of a clip, anchors, and a heatsink.

Description

              The disclosed method is a unified heatsink and mechanical stiffening solution (see Figure 1). It is an SMT device rather than a through-hole device that combines the clip, anchors, and heatsink as a single unit (see Figure 2).

              The manufacturing steps to produce the unit are as follows:

1.      Stamp the unit from sheet metal (see Figure 3).
              a.           Cut out the space for the die.
              b.           Cut for the support solution formation.
              c.           Cut the tabs to form the box.

2.      Fold the tabs to form the box and weld the sides together (see Figure 4).

3.      Form the supports to create a rigid system that spans the length of the heatsink package and a surface mount lead to solder the unit to the PCB (see Figure 1).

              The surface of the PCB includes the IC package and surface mount pads (see Figure 5).

Advantages

              The disclosed method provides advantages, including:

·        Simplified manufacturing due to being a single-point solution

·        Reduced cost

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Fig. 2

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Fig. 4

Fig. 5

Disclosed anonymously