Browse Prior Art Database

INVERTED PCB HEAT SLUG/SINK FOR MICROELECTRONIC PACKAGES

IP.com Disclosure Number: IPCOM000008402D
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-12
Document File: 2 page(s) / 103K

Publishing Venue

Motorola

Related People

Bret A. Zahn: AUTHOR

Abstract

Thermal characteristics of packaged semicon- utilize less space. Many traditional heat sinks are ductor devices have long been a major concern clipped or glued directly to the electronic packages for both manufacturers and users of electronic upper casing. These "clip-on" heat sinks dramatically products. Increased power dissipations, along with increase printed circuit board (pcb) profiles and do smaller integrated circuits and packages, require the not take full advantage of the board's ability to sink cost effective utilization of heat sinks or slugs heat, especially those boards which are thermally which are simple in design, light in weight, and enhanced.

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@ MOTOROLA

Technical Developments

INVERTED PCB HEAT SLUG/SINK FOR MICROELECTRONIC PACKAGES

by Bret A. Zahn

  Thermal characteristics of packaged semicon- utilize less space. Many traditional heat sinks are ductor devices have long been a major concern clipped or glued directly to the electronic packages for both manufacturers and users of electronic upper casing. These "clip-on" heat sinks dramatically products. Increased power dissipations, along with increase printed circuit board (pcb) profiles and do smaller integrated circuits and packages, require the not take full advantage of the board's ability to sink cost effective utilization of heat sinks or slugs heat, especially those boards which are thermally which are simple in design, light in weight, and enhanced.

External copper Plane

Internal Copper Plane

Electrical Via's Thermal via's Inverted Finned Thermal Disconnect

Heat Slug/Sink Region

Fig. 1 BGA package mounted on thermally enhanced pcb.

Figure 1 shows a ball grid array (BGA) package

mounted on a printed circuit board which contains internal copper planes for the purpose of heat spreading and enhanced power dissipation. Unfortunately, the electrical via's which travel through the printed circuit board cause a thermal disconnect between those copper planes which lie directly below the package, and those which lie outside of the package perimeter (see Figure 2). This thermal disconnect prevents the efficient uniform spreading of any heat which is generated

due to the normal operation of the device, thereby cre...