Browse Prior Art Database

BALL GRID ARRAY REMOVAL TOOL

IP.com Disclosure Number: IPCOM000008406D
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-12
Document File: 2 page(s) / 73K

Publishing Venue

Motorola

Related People

William B. Mullen: AUTHOR [+3]

Abstract

During the course of the development and manufacturing of circuit assemblies which utilize Ball Grid Array (BGA) technology, there are occa- sions when it becomes necessary to remove large quantities of these devices as part of a salvage oper- ation. Commercial equipment is currently available for this purpose, but carries with it a substantial capital cost, Often times salvage and repair opera- tions are not adequately funded to support the implementation of all the unique technologies needed to perform the special processes on the circuit assemblies, or the need to process large numbers of assemblies may cause excess utilization requirements to be focused on a BGA removal process. With the device described herein, the authors propose a tool specifically designed for low cost removal of BGA from the printed circuit boards. The device can be easily fabricated with minimal expense. As with most soldering devices, there are considerations for operator safety due to the temperatures needed to melt solder. But when handled properly this device is easy to deploy.

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MOTOROLA Technical Developments

BALL GRID ARRAY REMOVAL TOOL

by William B. Mullen, Kingshuk Banerji and Alan Clayton

  During the course of the development and manufacturing of circuit assemblies which utilize Ball Grid Array (BGA) technology, there are occa- sions when it becomes necessary to remove large quantities of these devices as part of a salvage oper- ation. Commercial equipment is currently available for this purpose, but carries with it a substantial capital cost, Often times salvage and repair opera- tions are not adequately funded to support the implementation of all the unique technologies needed to perform the special processes on the circuit assemblies, or the need to process large

numbers of assemblies may cause excess utilization requirements to be focused on a BGA removal process. With the device described herein, the authors propose a tool specifically designed for low cost removal of BGA from the printed circuit boards. The device can be easily fabricated with minimal expense. As with most soldering devices, there are considerations for operator safety due to the temperatures needed to melt solder. But when handled properly this device is easy to deploy.

The following figure illustrates the tool concept.

Groun

Amp DC

Insulated Too\ Body

Conductive Fingers

PGA Balls

Element

l- PCB Substrate

L1 Moforolu. Inc. ,997 50 December I997

[This page contains 14 pictures or other non-text objects]

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MOTOROLA Technical Developments

  The de...