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RE-DISTRIBUTION FOR FLIP CHIP

IP.com Disclosure Number: IPCOM000008444D
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-14
Document File: 3 page(s) / 150K

Publishing Venue

Motorola

Related People

Dwight Daniels: AUTHOR [+2]

Abstract

Re-distribution of die pads, is used to re-distribute the fine pitch die pads out to a larger pitch for flip chip devices. Re-distribution can be constructed out of a number of various materials (e.g. low cost co-fired ceramic, flex circuitry, glass, thin-film organic laminates, etc. material). The re-distribution material discussed within, is a single layer, double sided substrate that re-distributes the die pads. Co-fired ceramic technology was initially selected because of its tine pitch pattern capability, but other materials may be used to accomplish the same results. The case example discussed within, is a co-fired ceramic substrate that re-distributes a IOOpm die pads pitch out to 5OOum solderball pitch (or greater), with standard technology for co-fired ceramic.

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MOTOROLA Technical Developments

RE-DISTRIBUTION FOR FLIP CHIP

by Dwight Daniels and Jeffrey Alan Miks

ABSTRACT

Re-distribution of die pads, is used to re-distribute

the fine pitch die pads out to a larger pitch for flip chip devices. Re-distribution can be constructed out of a number of various materials (e.g. low cost co-fired ceramic, flex circuitry, glass, thin-film organic laminates, etc. material). The re-distribution material discussed within, is a single layer, double sided substrate that re-distributes the die pads. Co-fired ceramic technology was initially selected because of its tine pitch pattern capability, but other materials may be used to accomplish the same results. The case example discussed within, is a co-fired ceramic substrate that re-distributes
a IOOpm die pads pitch out to 5OOum solderball pitch (or greater), with standard technology for co-fired ceramic.

PROBLEM

The purpose of re-distribution is to spread

out the die pad pitch so that the die can be flip chip mounted on the board/substrate using existing technology. Flip chip mounting should result in lower costs since the manufacturing is simplified for flip chip. However, this is not the case. Current re-distribution technologies have a greater cost associated with the technology when compared to

wire bonding technology costs. Thus, the cost target for re-distribution must be at parity with the wire bond costs.

SOLUTION

  The re-distribution technology is a single layer, double sided substrate that re-distributes the die pads (see Figures). Co-fired ceramic technology was initially selected because of its fine pitch pattern capability, but other materials may be used to accomplish the same results, The case example discussed within is a co-fir...