Browse Prior Art Database

Method for a retention/attachment mechanism for an electronic package thermal solution

IP.com Disclosure Number: IPCOM000008470D
Publication Date: 2002-Jun-17
Document File: 3 page(s) / 107K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a retention/attachment mechanism for an electronic package thermal solution. Benefits include improved thermal performance, improved throughput, and improved reliability.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Method for a retention/attachment mechanism for an electronic package thermal solution

Disclosed is a method for a retention/attachment mechanism for an electronic package thermal solution. Benefits include improved thermal performance, improved throughput, and improved reliability.

Background

              Conventionally, metal clips are used to snap a thermal solution into place on an electronic package (see Figure 1). The clips ensure the orientation and compressive load of the thermal interface material (TIM).

General description

              The disclosed method is a spring-clip design and assembly procedure for a thermal enhancement attachment to an electronic package. The key elements include:

·        Spring-clip design that can be mounted to an electronic package substrate using standard surface mount assembly processes

·        A design that enables the thermal solution to be snapped onto the electronic package without a fixture or special tools

·        A flexible clip design (geometry) that enables adjustable retention forces that translate into higher or lower TIM compressive loadings

·        A design feature that enables the thermal solution to be easily removed without special tools

Advantages

      The disclosed method provides advantages, including:

·        Snap-on design to quickly mount the thermal solution without fixtures

·        Clips that can be surface mounted using standard surface mount processes on the front-of-line assembly process

·        Clips that can be designed with varying spring rates through different tempering, materials, or thickness to control thermal interface material compressive load

·        Design that can incorporate...