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Method for a universal direct CPU heatsink duct

IP.com Disclosure Number: IPCOM000008475D
Publication Date: 2002-Jun-17
Document File: 6 page(s) / 275K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a universal direct CPU heatsink duct. Benefits include improved thermal performance.

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Method for a universal direct CPU heatsink duct

Disclosed is a method for a universal direct CPU heatsink duct. Benefits include improved thermal performance.

Description

              The disclosed method is a universal side-intake duct for CPU fan heatsinks. The duct provides a direct air source to the CPU fan heatsink at external ambient temperature, rather than chassis internal ambient temperature. Impacts to other critical areas within the typical system can show net positive impact with proper chassis air flow balancing. The method is adaptable to existing chassis form factors with minimal re­design and enabling efforts.

Advantages

              The disclosed method provides advantages, including:

·        Reduces effective CPU inlet temperature significantly

·        Enables more common and less expensive CPU thermal solutions

Detailed description

              The disclosed method contains several design components, including:

·        Lower Duct

-         Wide opening over CPU heatsink for varying CPU locations in the X-Y plane

·        Upper Duct

-         Ribbed wall structure for length adjustment (see Figure 4)

·        Chassis Mounting Flange

-         Simple screw mounting to chassis side cover.

·        Recommended Chassis Side Vent Pattern

-         60% open staggered 5mm hole pattern geometry

-         Validated for minimal impact to intake air flow

-         Common vent pattern for many chassis manufacturers

·        EMI shield (not shown)

-         May be required.

-         Located between the upper duct and the chassis side cover

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Disclosed anonymously