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Method for spring loaded/tension socket pins

IP.com Disclosure Number: IPCOM000008478D
Publication Date: 2002-Jun-17
Document File: 5 page(s) / 369K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for spring loaded/tension socket pins. Benefits include reduced damage, reduced defective product returns, and improved ease of manufacturing.

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Method for spring loaded/tension socket pins

Disclosed is a method for spring loaded/tension socket pins. Benefits include reduced damage, reduced defective product returns, and improved ease of manufacturing.

Background

              Customer-induced bent pins and shorts in the CPU core make up over 15% of the total customer defective-CPU returns in 2001. The units are returned by the customer with the assumption that the processor failed quality/reliability standards. Additionally, several customers have reported a build up of units with damaged/bent pins that are recognized as damaged on the customer manufacturing line.

              The annual value of damaged material is estimated at several million dollars. The root cause of the damaged material is understood to be handling by the customer’s line technicians. However, the claim is that the product package design is not conducive to high volume manufacturing (HVM). Customers require a robust CPU package that is not easily susceptible to ESD or mechanical pin damage.

              Customers rely on technician training to ensure that proper handling and ESD preventive measures are being executed at assembly sites. Quick turnaround of employees and high volume manufacturing presents a problem to the manufacturer in keeping technician training up to date and in enforcing procedures.

              In the conventional method, pins are surface mounted to the substrate and exposed to ESD and mechanical damage (see Figure 1). Great care must be made in handling the part in an HVM environment.

General description

              The disclosed method is a CPU socket pin design. A spring applies force on an outer pin shell that makes contact with a pad of a pinless CPU and is held in contact with an inner contact pin by separate springs giving the outer pin shell some freedom of movement.

              The conductive and bendable pins of the CPU package are removed. An insulating barrier protects the CPU from coming in contact with an electrically charged material and mechanical force, which results in bent pins. The spring in the disclosed design applies force on a pin cover that ensures a good electrical contact with the pads of the pinless CPU.

 


Advantages

              The disclosed method provides advantag...