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Serpentine Heat Sink Design

IP.com Disclosure Number: IPCOM000008485D
Publication Date: 2002-Jun-17
Document File: 3 page(s) / 289K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a new heat sink design that enables thermal dissipation on chips. The new design improves thermal dissipation while retaining a small form factor.

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Serpentine Heat Sink Design

Disclosed is a method for a new heat sink design that enables thermal dissipation on chips. The new design improves thermal dissipation while retaining a small form factor.

Background

High speed signaling has become a necessary requirement for all communications chips; however, at high frequencies and high densities, thermal dissipation on chip:

§         Limits the highest usable frequency of the device

§         Limits the highest power that the package can dissipate

Current devices achieve high thermal performance by using heat sinks and/or airflow. The small form factor of some of these devices (e.g. optical modules which trend toward extremely compact sizes and cannot accept devices beyond a certain size) restrict the size of the heat sinks in the X, Y, and Z dimensions; this limits the thermal dissipation of the chip. In addition, all existing heat sinks have only simple fins, thereby under utilizing heat sink real estate.

General Description

The disclosed method uses a heat sink with a three-dimensional serpentine design. This design enhances current heat sink designs by increasing surface area by 90%, thereby improving the heat sink’s capacity for thermal dissipation. Figures 1 through 4 show details of  the serpentine design.The figures show a proposed design that is 10mm tall. This design concept can be extended (e.g. 10x10 or 15x15), and can be optimized by considering different fin thickness and fin spacing. The design is under further investigation.

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