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Method for a snap-on-lid thermal apparatus for an electronic device using a post and catch socket

IP.com Disclosure Number: IPCOM000008487D
Publication Date: 2002-Jun-17
Document File: 5 page(s) / 134K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a snap-on-lid thermal apparatus for an electronic device using a post and catch socket. Benefits include improved reliability and improved throughput.

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Method for a snap-on-lid thermal apparatus for an electronic device using a post and catch socket

Disclosed is a method for a snap-on-lid thermal apparatus for an electronic device using a post and catch socket. Benefits include improved reliability and improved throughput.

Background

              The conventional integrated heat spreader attachment (IHSA) process is expensive in several ways. Too much time is spent in processing. Equipment costs are high for sealant adhesive dispensing, clip placement and removal, and sealant curing. For example, spring clips are used to apply force (6 to 16 lbs) to the package during cure and then removed (see Figures 1 and 2).

General description

              The disclosed method is an IHSA snap-on lid using post and catch socket design. Catch sockets are surface mounted to the substrate using standard solder reflow equipment. Conventional IHS lids are revised to incorporate a button-head post. Low-cost equipment is required to assemble the lids on to the substrates.

              The key elements of the method include:

·        Modified IHS lid with pressed-in (or other mounting method) post

·        Surface mounted spring-retention receptacles (catch socket)

·        Substrate pads in the appropriate location for receptacle mounting via fast component mounter-like equipment

Advantages

              The disclosed method provides advantages, including:

·        Potential for increased through-put of the IHSA process, enabling increased capacity

·        Elimination of the requirement for sealant dispense and the associated oven cure cycle

·        Elimination of the requirement for installation of a special clip to hold the heat spreader in place during the sealant cure cycle

·        Elimination of the requirement to remove the retention clip after IHS attachment

·        Reduction of yield loss associated with lid placement from .08% to .23%

·        Reduction of overall assembly cost

Detailed Description

              The disclosed method is that IHSA snap-on lid using post and catch socket design. Catch sockets are surface mounted to the substrate using standard chip mounter (CM) and reflow equipment. Conventional IHS lids are revised to incorporate a button-head post. Low-cost procurement and produc...