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ELECTROSTATIC DISCHARGE CONTROL THROUGH THE USE OF A CONDUCTIVE BONDING WASHER

IP.com Disclosure Number: IPCOM000008550D
Original Publication Date: 1998-Mar-01
Included in the Prior Art Database: 2002-Jun-24
Document File: 2 page(s) / 92K

Publishing Venue

Motorola

Related People

Mark E. Schermerhorn: AUTHOR [+2]

Abstract

This paper describes a method of providing a dc electrical bond between the chassis of a unit and a conductive composite panel when using a non- conductive adhesive to secure threaded inserts.

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MOTOROLA Technical Developments

ELECTROSTATIC DISCHARGE CONTROL THROUGH THE USE OF A CONDUCTIVE BONDING WASHER

by Mark E. Schermerhorn and Charles 6. Andes

ABSTRACT

  This paper describes a method of providing a dc electrical bond between the chassis of a unit and a conductive composite panel when using a non- conductive adhesive to secure threaded inserts.

PROBLEM ENCOUNTERED IN CURRENT MANUFACTURING

  A situation in current manufacturing exists where modules are attached to a conductive struc- ture by means of threaded inserts fastened with a non-conductive adhesive. This non-conductive adhesive acts as an insulator between equipment chassis and the single point system ground associated with most space products, Since these chassis are isolated from ground, a difference in ground potential between this chassis and the single poinl ground or between equipment chassis on the same system may occur. This difference in ground potential can be a possible source for Electrostatic Discharge (ESD).

  Furthermore, any ESD introduced from a source outside the system (i.e. someone touching the chassis) will have no direct path to the single point ground, but instead may find its path to ground through ESD sensitive parts. Most electronics are designed to operate with a single common ground (return) path.

  ESD problems can be of a catastrophic nature where the problem shows up immediately, an accu- mulative nature where the affected part slowly degrades over time, or of a latent nature where fail- ure occurs after the unit is in the field (or in space).

SOLUTION TO THE PROBLEM

To overcome this type of an ESD situation,

equipment chassis need to all be bonded to a similar ground. A simple approach to achieve this bonding is through the use of a device that gets captured u...