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THERMOSTRAP DUAL SURFACE, LOW PROFILE, ELECTRONIC SYSTEM HEAT SINK

IP.com Disclosure Number: IPCOM000008551D
Original Publication Date: 1998-Mar-01
Included in the Prior Art Database: 2002-Jun-24
Document File: 2 page(s) / 90K

Publishing Venue

Motorola

Related People

Bret A Zahn: AUTHOR [+2]

Abstract

Adequate cooling has long been a major concern for both manufacturers and users of electronic prod- ucts. Many of the benefits associated with improved reliability, increased power capability, and physical miniaturization can be traced directly to improved thermal cooling designs which have allowed device temperatures to be stabilized at a desired level despite variations in ambient conditions or the presence of a hostile operating environment. Increased device power dissipation along with smaller integrated circuits, packages, and printed circuit boards (pcb), require the cost effective and innovative application of heat sinks which are simple in design, light in weight, and utilize less space. In many electronic systems the problem of passively cooling high power devices has been dealt with through the utilization of "package level" heat sinks. Unfortunately, these types of heat sinks connect to only one package and have a limited surface area, and thus a finite cooling ability, while dramatically increasing the height or profile of the printed circuit board as shown in Figure 1.

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Technical Developments

THERMOSTRAP DUAL SURFACE, LOW PROFILE, ELECTRONIC SYSTEM HEAT SINK

by Bret A Zahn and David T. Billings

PROBLEM BACKGROUND

  Adequate cooling has long been a major concern for both manufacturers and users of electronic prod- ucts. Many of the benefits associated with improved reliability, increased power capability, and physical miniaturization can be traced directly to improved thermal cooling designs which have allowed device temperatures to be stabilized at a desired level despite variations in ambient conditions or the presence of a hostile operating environment. Increased device power dissipation along with

smaller integrated circuits, packages, and printed circuit boards (pcb), require the cost effective and innovative application of heat sinks which are simple in design, light in weight, and utilize less space. In many electronic systems the problem of passively cooling high power devices has been dealt with through the utilization of "package level" heat sinks. Unfortunately, these types of heat sinks connect to only one package and have a limited surface area, and thus a finite cooling ability, while dramatically increasing the height or profile of the printed circuit board as shown in Figure 1.

Fig. 1 Package level heat sinks increase printed circuit board profiles while only providing cooling for a single device.

SOLUTION

A cheap and efficient alternative to isolated package level heat sinks is the use of a thin sheet of

highly conductive material which can be shaped or molded to "strap" around the entire printed circuit board, thereby making contact with all of the heat sink dependent packages. An example of this is shown in Figure 2. The advantag...