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Method for symmetrical dual-sided multi-pack systems board assembly on a single SMT manufacturing line

IP.com Disclosure Number: IPCOM000008593D
Publication Date: 2002-Jun-25
Document File: 4 page(s) / 426K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for symmetrical dual-sided multi-pack systems board assembly on a single surface-mount technology (SMT) manufacturing line. Benefits include improved manufacturing simplicity and improved product reliability.

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Method for symmetrical dual-sided multi-pack systems board assembly on a single SMT manufacturing line

Disclosed is a method for symmetrical dual-sided multi-pack systems board assembly on a single surface-mount technology (SMT) manufacturing line. Benefits include improved manufacturing simplicity and improved product reliability.

Background

              Two-sided board assembly requires redundant assembly processing on an SMT line with jig and fixture (stencil and support block) and heavy capital investment. Conventional systems board design requires 2-sided assembly process consisting of single-board layout on a primary and a secondary board side (see Figures1 and 2). The top and bottom sides are handled separately. Primary and secondary SMT lines, designated as SMT1 and SMT2, are required to assemble 2-sided boards. SMT1 is setup to assemble the top side, while SMT2 is setup to assemble the bottom side or vice versa on single and multi-pack boards.

General description

      The disclosed method is a design for systems boards that require 2-sided assembly process (type 2). A symmetrical board layout is comprised of a top-side and a bottom-side board layout with primary and secondary sides for multi-pack boards combined in a panel. The multi-pack board has an even number of boards so that it can be symmetrical with the other board side.

      The key elements of the method include:

·        Symmetrical primary and secondary sides board layout with top and bottom layout on respective sides

·        Multi-pack systems boards that can be separated either through depanelling process or manual breakaway after full assembly

·        Global and local fiducials that differentiate the mounted and unmounted, primary and secondary board sides

Adv...