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UNIVERSAL FIXTURING FOR GTPAC AUTO ROUTER SINGULATION

IP.com Disclosure Number: IPCOM000008621D
Original Publication Date: 1998-Mar-01
Included in the Prior Art Database: 2002-Jun-27
Document File: 2 page(s) / 100K

Publishing Venue

Motorola

Related People

Doug Henderson: AUTHOR [+2]

Abstract

In the singulation of semiconductor units from a matrix board (leadframe), such as the BGA style product, it is necessary for the board to be held firmly in place. If the board is allowed to move during the router singulation, the packages may not be within the specified package outline. Also, to allow for high product mix of varying sized packages. fast and easy changovers are required.

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MOTOROLA Technical Drvelopments

UNIVERSAL FIXTURING FOR GTPAC AUTO ROUTER SINGULATION

by Doug Henderson and Jim Letterman

sealed surface for improved vacuum hold down. This approach was time consuming and proved not to be production worthy. With the hard tooling approach, if a fixture nest became damaged, a completed hard fixture needed to be remade. This was also time consuming and expensive. The hard tooling fixture was bolted down onto a platform in which up to eight hard tixturing plates could be located. This approach was time consuming for setup changes from one package size to another.

PROBLEM SOLUTION

  With liquid encapsulated semiconductor products, such as OMPAC or GTPAC BGA'S con- structed on a BT-RESIN board, the conventional punch and die trim process used for singulation often leads to delamination or package damage. To eliminate these issues, the introduction of an auto router singulation system was incorporated into manufacturing. Securely holding the complete board and individual units being routed out (singu- lated) is very critical for holding the dimensional tolerances of the products package outline. Fixturing supplied by the manufacturer was hard tooled and would not hold the units in place during routing causing them to fail package outline. Various sealant materials were evaluated to form a

BACKGROUND

  In the singulation of semiconductor units from a matrix board (leadframe), such as the BGA style product, it is necessary for the board to be held firmly in place. I...