Browse Prior Art Database

MULTI PACKAGE TRACK FOR FINAL TEST HANDLER

IP.com Disclosure Number: IPCOM000008815D
Original Publication Date: 1998-Sep-01
Included in the Prior Art Database: 2002-Jul-16
Document File: 3 page(s) / 166K

Publishing Venue

Motorola

Related People

Low Teik Kheong Kenneth: AUTHOR [+2]

Abstract

Figure I below shows a cross section of a known track for transporting semiconductor components, par- ticulary in a handler for a machine used at a final test stage of the component packaging process. The track transports only one type of package. Hence, it is desir- able, therefore, to have a track for transporting a var- ety of different types of packages to allow the machines at the final test stage to be used to test semi- conductor components which are packaged in a variety of different types of packages. In particular, such a track would be useful when rapid prototyping of new products to generate samples; pilot production runs on existing equipment; sharing of equipment allowing a more flexible and more productive production facility; and reliability testing of cycle time reduction.

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MOTOROLA Technical Developments

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MULTI PACKAGE TRACK FOR FINAL TEST HANDLER

by Low Teik Kheong Kenneth and Chew Chee Chuan

INTRODUCTION

  Figure I below shows a cross section of a known track for transporting semiconductor components, par- ticulary in a handler for a machine used at a final test stage of the component packaging process. The track transports only one type of package. Hence, it is desir- able, therefore, to have a track for transporting a var- ety of different types of packages to allow the machines at the final test stage to be used to test semi- conductor components which are packaged in a variety of different types of packages. In particular, such a track would be useful when rapid prototyping of new products to generate samples; pilot production runs on existing equipment; sharing of equipment allowing a more flexible and more productive production facility; and reliability testing of cycle time reduction.

Fig. 4 A Proposed Track Design

  With reference to Figure 4, a top part of a track is shaped according to the top of the different types of packages, and roller bearings are placed on the inside of the track to facilitate movement of the different types of packages along the track. With reference to Figure 5, each roller bearing is partially embedded in the track and is spring loaded to accomodate for sbght deformities on the different types of packages. The springs also act as a cushion for the different types of packages.

Semicon package

I Track

Leads

Fig. 1 Known Track Design

  The basis of the proposed design is, based on a device type in a semiconductor package as well as test- ing capabilities of a tester, the type of products and hence the type of packages most likely to be tested on a particular tester can be determined, and a track design made to accommodate all the different types of packages. An example is shown in Figure 4.

I ~ Bearing movement in t

ZaxiS- Fig. 5 Design Of The Track Ball Bearings

e Molorolr. 1°C. ,998 82 September ~1998

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64 MOTOROLA

Technical Developments

  With reference to Figure 6, the height of the grooves on the track would be designed to accommo- date the different types of packages so that the leads of t...