Browse Prior Art Database

LEAD ON CHIP TAPE ADHESIVE STRENGTH TESTER

IP.com Disclosure Number: IPCOM000008830D
Original Publication Date: 1998-Sep-01
Included in the Prior Art Database: 2002-Jul-17
Document File: 4 page(s) / 201K

Publishing Venue

Motorola

Related People

Wh Chan: AUTHOR [+2]

Abstract

A conventional die shear tester is not capable of measuring die shear strength effectively for lead on chip (LOC) devices. To determine the adhesive strength between the die to LOC tape interface, an adhesive strength tester was developed by modifying the conventional die shear tester. Conventionally, a manual hand peel method was used to determine the tape adhesion quality. This method of testing is not quantifiable, produces reliable results, and has large variation when different operators perform the peeling. The development of this tape adhesive strength tester provides a means of quantifying the tape adhesion quality for in line monitoring, and also serves as a reli- able tool for process characterization.

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Page 1 of 4

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MO7VROLA Technical Developments

LEAD ON CHIP TAPE ADHESIVE STRENGTH TESTER

by Wh Chan and Caron Kee Tze Ping

BACKGROUND

   A conventional die shear tester is not capable of measuring die shear strength effectively for lead on chip (LOC) devices. To determine the adhesive strength between the die to LOC tape interface, an adhesive strength tester was developed by modifying the conventional die shear tester. Conventionally, a manual hand peel method was used to determine the tape adhesion quality. This method of testing is not quantifiable, produces reliable results, and has large variation when different operators perform the peeling. The development of this tape adhesive strength tester provides a means of quantifying the tape adhesion quality for in line monitoring, and also serves as a reli- able tool for process characterization.

Fig. 1 Mechanism of the Conventional Die Shear Tester

ADHESIVE STRENGTH TESTER COMPONENTS

  The LOC tape adhesive strength tester is a modi- fied conventional die shear tester. The modification adds two assemblies into the conventional tester, namely a frame holding assembly and a pusher pin assembly. Figure 1 shows the mechanism of the con- ventional die shear tester and Figure 2. shows the mechanism of the new adhesive strength tester. This design concept allows easy conversion for testing dif- ferent devices by simply slotting in different frame holding assemblies. In addition, it also makes the con- version from LOC tape adhesive strength tester to con- ventional die shear tester convenient as the two addi- tional assemblies can be removed in minutes, without affecting the performance of the conventional die shear tester.

Fig. 2 Mechanism of the Adhesive Strength Tester

  The frame holder assembly consist of a clamp plate holder which is shown in Figure 3. The clamp plate assembly is used to hold the frame and the die in position during testing, and the clamp plate holder is designed to hold the clamp plate assembly to the con- ventional die shear tester.

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Fig. 3 Frame Holder Assembly

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Page 2 of 4

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MOTOROLA Technical Developments

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Fig. 6 Pusher Pin Assembly

OPERATIONS OF LOC ADHESIVE STRENGTH TESTER

Fig. 4 Clamp Plate Assembly

  The clamp plate assembly has three components namely clamp plate #I, clamp plate #2, and a shoulder plate. Figure 4. shows the front view of clamp plate #I and #2 and Figure 5. shows the front view of the clamp plate assembly with the shoulder. Clamp plate #l and #2 are mounted together by screws to hold the lead- frame in position for testing. Clamp plate #l is placed on a side towards a pusher pin which has a clamp plate opening that allows the pusher pin to move through when performing the strength test. The shoulder pro- vide suppor...