Browse Prior Art Database

POLY SOCKET

IP.com Disclosure Number: IPCOM000008861D
Original Publication Date: 1998-Sep-01
Included in the Prior Art Database: 2002-Jul-18
Document File: 2 page(s) / 94K

Publishing Venue

Motorola

Related People

Stephen Harrison: AUTHOR [+3]

Abstract

This paper describes an on-board PCB or test socket for packaged electronic devices such as PLCC, SOIC, BGA & CSPS, this socket provides a simple method of device interconnection to a printed circuit board or test equipment interface.

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MOTOROLA Technical Developments

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POLY SOCKET

by Stephen Harrison, Mike Fage and Michael Beattie

ABSTRACT

  This paper describes an on-board PCB or test socket for packaged electronic devices such as PLCC, SOIC, BGA & CSPS, this socket provides a simple method of device interconnection to a printed circuit board or test equipment interface.

contacts to achieve electrical contact, the design of these sockets are becoming more and more complex and costly due to the smaller device package option becoming available. One answer to this problem is to simplify the construction of the socket, while allowing the maximum amount of flexibility in con- tact shape and positioning with lower cost. The 'Poly Socket' described below enables these fea- tures for both device and board test.

INTRODUCTION

   The lack of availability of test or board sockets for new and emerging device packaging has slowed down the development and release and acceptance of such devices into the market place. The predomi- nant socket technology today rely on sprung metal

POLY SOCKET

The 'Poly Socket' consists of a basic carrier with a removable device inserts (See Figure 1).

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compr&o~ Pad/spring

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Top View Sample Polymer Bump Carriers

Fig. 1

e Motoroh 1°C ,998 112 September 1998

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MOTOROLA Technical Developments

  The device carrier can be mechanically secured to a test system or be soldered to a printed circuit board. The carrier for th...