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Method of reducing the engagement force of an electronic package to the socket assembly

IP.com Disclosure Number: IPCOM000008877D
Publication Date: 2002-Jul-19
Document File: 3 page(s) / 143K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method of reducing the engagement force of an electronic package to the socket assembly. Benefits include improved socket actuation performance.

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Method of reducing the engagement force of an electronic package to the socket assembly

Disclosed is a method of reducing the engagement force of an electronic package to the socket assembly. Benefits include improved socket actuation performance.

Background

              High engagement force is required to engage the package with the socket. This problem is conventionally solved by applying high force for socket actuation.

              In the conventional electronic package assembly, a socket is mounted on a motherboard (or test board). An electronic pin grid array (PGA) package is inserted into the socket through the cover into the socket base where the contacts (terminals) are located. Direct contact occurs between the package pin and the socket contact (terminal). Contact occurs between two gold surfaces and results in a coefficient of friction of 0.3. The package pin sits inside the contact and, at actuation, moves into the narrow region of the contact, completing the electronic circuit (see Figure 1). Typically, the maximum number of insertion cycles is approximately 15-20.

General description

              The disclosed method adds an electrically conductive element or tape to the contact beams of the socket to reduce friction and result in a much lower force required to engage the package to the socket.

              The key elements of the method include:

·        Socket base

·        Terminal (contact)

·        Contact tape for reducing friction

·        Electronic package

Advantages

              The disclosed method provides advantages including:

·        Force re...