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Method for a surface-mount ceramic spacer

IP.com Disclosure Number: IPCOM000008879D
Publication Date: 2002-Jul-19
Document File: 2 page(s) / 76K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a surface-mount ceramic spacer. Benefits include reductions in cost and through-put time at the capacitor manufacturers facility.

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Method for a surface-mount ceramic spacer

Disclosed is a method for a surface-mount ceramic spacer. Benefits include reductions in cost and through-put time at the capacitor manufacturer’s facility.

Background

      Mechanical stand off occurs for package designs that require specific support on critical areas of the package to reduce/avoid interaction between adjoining substrates. Conventionally, this problem is solved by using fully functional ceramic capacitors (see Figure 1).

General description

              The disclosed method uses a chip component as a mechanical spacer or standoff in package applications.

              The key elements of the disclosed method include:

·        Surface-mount technology (SMT) capability

·        Ceramic-type material

·        No electrical conductivity

·        One or more terminations

·        Compliant with EIA case-size standards but alternatives are possible for customized applications

Advantages

              The disclosed method provides advantages, including:

·        Similar mechanical characteristics and reliability potential as the conventional solution

·        Reduced through-put time during the supplier’s build-up process and elimination of electrical testing

·        Reduced cost

Detailed description

              The disclosed method is a ceramic chip component with one or more solder terminations for SMT capabilities (see Figure 2). The ceramic spacer has a similar construction as the conventional ceramic capacitor but lacks internal electrodes. The main functionality is as a standoff for package applications.

The disclosed method can...