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Method for a component package apparatus for optimized high-current power delivery

IP.com Disclosure Number: IPCOM000008880D
Publication Date: 2002-Jul-19
Document File: 4 page(s) / 140K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a component package apparatus for optimized high-current power delivery. Benefits include improved power delivery.

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Method for a component package apparatus for optimized high-current power delivery

Disclosed is a method for a component package apparatus for optimized high-current power delivery. Benefits include improved power delivery.

Background

              Demands on power delivery have increased as part of the effort to achieve higher performance in logic silicon products. Higher currents, in addition to better current transient response and bypass capacitance, are frequently the key parameters sought in successful power delivery design. Potential bottlenecks in the delivery of power to the component are the printed circuit board (PCB) and the socket-to-component interface.

              On conventional component packages, the same interconnect structure is used for both the power and signal connection even though the requirements for power and signaling can be different. A top-down view of a typical component interconnect array illustrates how the same pad structure is used for both connections (see Figure 1). The relatively low-area pad can limit current to the component. This construction can also limit the number of vias available to distribute power through the package. Counteracting this impact  can often lead to an increased number of power/ground pads that can lead to excessively large packages. In addition, these power connections compete with much-needed I/O connections on the component.

Description

              The disclosed method includes a ganged pad interface with a compression contact socket.  The ganged component pad structure replaces individual pads (see Figure 2). The purpose of this structure is to form an optimized contact area in  which electrical contact may be made through solder, an array of pins or a compression contact. The ganged pad...