Browse Prior Art Database

Method for a simplified microprocessor assembly on a motherboard

IP.com Disclosure Number: IPCOM000008881D
Publication Date: 2002-Jul-19
Document File: 2 page(s) / 124K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a microprocessor (µP) assembly on a motherboard (MB). Benefits include cost reduction through a simplified manufacturing process and socket elimination.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 82% of the total text.

Method for a simplified microprocessor assembly on a motherboard

Disclosed is a method for a microprocessor (µP) assembly on a motherboard (MB). Benefits include cost reduction through a simplified manufacturing process and socket elimination.

Background

              Using a complex, surface mounted socket assembly on a MB is problematic (development, manufacturing, assembly, customized to product requirements). The cost of the socket comprises a significant percentage of system cost.

General description

              The disclosed method is a simplified µP assembly on a motherboard, replacing the conventional complex socket assembly. The key elements of the method include:

·        A retention mechanism that is designed to snap into or surface mount on the MB and hold the mP package in place

·        Anisostropic conductive film (ACF) to create electrical contact and compensate for co-planarity mismatch between the µP package and the MB

              The addition of an integrated heat spreader (IHS) can create additional even pressure across package/MB contact to compensate for co-planarity mismatch.

Advantages

      The disclosed method provides advantages including:

·        Simplification of the µP/MB assembly

·        Elimination of conventional sockets

·        Reduction in cost

Detailed description

              The disclosed method takes advantage of ACF characteristics as a medium to simplify the µP/MB assembly. The method uses snap-on or mounted retention mechanisms to hold the entire assembly in place during operation (see Figure 1).

      The disclosed method can...