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Method for a low-cost and reliable flexible vapor chamber for laptop cooling

IP.com Disclosure Number: IPCOM000008883D
Publication Date: 2002-Jul-19
Document File: 7 page(s) / 364K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a low-cost and reliable flexible vapor chamber (FVC) for laptop cooling. Benefits include improved thermal performance.

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Method for a low-cost and reliable flexible vapor chamber for laptop cooling

Disclosed is a method for a low-cost and reliable flexible vapor chamber (FVC) for laptop cooling. Benefits include improved thermal performance.

Background

      As laptop processors increase in frequency and processing capability, they produce increasing amounts of heat that must be removed to ensure the successful operation of the chip. Cooling is required without adding significantly to the laptop size, weight, and portability.

              The laptop screen is not yet conventionally utilized for heat dissipation. One solution is the hinge heat pipe concept (see Figure 1). Two heat pipes are connected through a mechanical hinge (similar to the door hinge). Some disadvantages of the hinge heat pipe are: poor hinge reliability, large contact thermal resistance at the hinge, and poor heat dissipation behind the screen. The hinge heat pipe uses copper heat pipes and a thick aluminum plate to dissipate heat by natural convection. This method is very inefficient (see Figure 2).

General description

      The disclosed method isa design for an FVC for laptop cooling. Accordion-type geometry enables the FVC to bend thousands of times without damaging the container structure yet remaining leakproof.

              The flexible material can be made of an aluminum or copper foil with plastic layers laminated on each side of the foil. This laminated foil can be wrapped around a plastic skeleton that ensures mechanical stability and prevents collapsing the external walls during the vacuum/fill charge operation. This structure ensures that the thickness of the FVC is kept as low as 2 mm with much lower weight than solid copper.

              The disclosed method uses low-cost materials, including plastic injection  parts and aluminum/copper foil laminated to plastic without machining or other costly operations. The aluminum/copper foil is brazed or soldered at the edges. Brazing and soldering is very suitable for low-cost high-volume manufacturing.

      The key elements of the method include:

·        Accordion-type geometry

·        Laminated metal/plastic foil wrapped around a plastic skeleton

·        Low weight and low form factor

Advantages

      The disclosed method provides advantages, including:

·        Improved thermal resistance (θsa) for laptops (about double)

·        Improved reliabil...