Browse Prior Art Database

WAFER FRAME DEVELOPMENT FOR TWO-DIRECTIONAL WAFER LOADING IN X-CELL DIE BONDING

IP.com Disclosure Number: IPCOM000008908D
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Jul-23
Document File: 2 page(s) / 147K

Publishing Venue

Motorola

Related People

Chang D.W: AUTHOR [+3]

Abstract

Because of the acceleration sensing die char- acteristics, X-lateral accelerometer wafer is fabri- cated with the crossed mask unlike other general wafer (shown in Figure 1) during its manufacturing process. The current die bond machine in X-lateral was designed for picking and bonding the general pattern die not the crossed (reversed) pattern die.

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MO-LA Technical Developments

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WAFER FRAME DEVELOPMENT FOR TWO-DIRECTIONAL

WAFER LOADING IN X-CELL DIE BONDING

by Chang D.W, Kim K.M and Park David

BACKGROUND

  Because of the acceleration sensing die char- acteristics, X-lateral accelerometer wafer is fabri- cated with the crossed mask unlike other general wafer (shown in Figure 1) during its manufacturing process. The current die bond machine in X-lateral was designed for picking and bonding the general pattern die not the crossed (reversed) pattern die.

  Therefore, operators have to do parameter set- ting twice per one wafer die bonding in order to pick the crossed pattern dice of X-cell wafer (the reversed dice).

PROBLEM DESCRIPTION

  To perform accelerometer wafer die bonding with current X-lateral bond machine, need addition- al parameter setting to pick the reversed dice. For example, P.R re-configuration, Pick-up tip recenter- ing, Bond 'Y' position readjustment, etc.

INVENTION

  To eliminate those additional process at X-later- al die bond process, need two directional wafer loading technology instead of one directional wafer loading method in current.

  To modify the die bond process as two direc- tional wafer loading, snipped out the wafer frame in symmetric like Figure 2 so that the frame secure two directional mark to be guided by wafer table in the die bonder. (In case of one directional wafer load- ing, one side snipping as guide mark is enough.)

  So, the die bond can achieve high productivity and eliminate...