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BALL GRID ARRAY AND CHIP SCALE PACKAGE PAD GEOMETRY WITH INTEGRATED COMPONENT FIDUCIALS

IP.com Disclosure Number: IPCOM000008923D
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Jul-24
Document File: 3 page(s) / 86K

Publishing Venue

Motorola

Related People

Ian Shute: AUTHOR [+2]

Abstract

This paper describes how, by integrating the The proposed solution relies on the two corner component placement fiducial, components can be pads, which are under the most stress and are there- placed more economically with respect to printed fore seldom used, being altered in shape as shown in circuit board real estate. Figure 3, Page 5.5.

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MO7DROLA Technical Developments

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BALL GRID ARRAY AND CHIP SCALE PACKAGE PAD GEOMETRY WITH INTEGRATED COMPONENT FIDUCIALS

by Ian Shute and Brian Cosgave

ABSTRACT SOLUTION

  This paper describes how, by integrating the The proposed solution relies on the two corner component placement fiducial, components can be pads, which are under the most stress and are there- placed more economically with respect to printed fore seldom used, being altered in shape as shown in circuit board real estate. Figure 3, Page 5.5.

INTRODUCTION This makes it easier for placement equipment to identify and use as a component fiducial.

  The ever-increasing customer need for smaller, lighter and more complex products, require that sur- The result is an improved, more efficient place- face mount printed circuit boards become smaller ment of component, using the printed circuit boards and more densely populated. real estate to maximum effect (Figure 4, Page 55).

  The introduction of Ball Grid Array type pack- ages (Figure 1, Page 54) has gone some way to fur- ther this process, but the need for local machine placement tiducials on this type of package, coun- teracts to a degree this initial advantage.

  The contents of the paper propose a possible solution to this issue, by integrating local placement tiducials, within the pad configuration of the com- ponent itself.

ISSUE

  Real estate on a complex printed circuit board can be at a premium and is often affected by the need for local placement fiduc...