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cooling of power components in an electronic circuit

IP.com Disclosure Number: IPCOM000008936D
Publication Date: 2002-Jul-25
Document File: 2 page(s) / 62K

Publishing Venue

The IP.com Prior Art Database

Abstract

ID608387

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ID608387

Cooling of power components in an electronic circuit.

   It is known to cool power components such as power transistors in an electronic circuit by bringing these power components into contact with a body with a high heat conductivity. Such a body can for instance be formed by the housing or part of the housing in which the electronic circuit is comprised such as a metal wall of this housing. To ensure a good contact between the power component and the housing the power component is placed at the edge of the printed circuit board on which the electronic circuit is implemented and is thereby positioned against the housing. To ensure the contact between the power component and the housing even better, a resilient member can be used to press the power component against the housing. In case the power component is positioned against a first wall of the housing, such a resilient member can for instance be positioned between the power component and an opposite wall of the housing. In case another power component is placed in contact with the opposite wall the resilient member can be situated between the two power components. Alternatively, in case another power component is placed in contact with a wall that is perpendicular to the first wall the resilient member can be placed in such a way that it presses against both the power components and the opposite wall. The resilient member can be formed out of metal or out of plastic. Preferably the resilient member can be in two states. In the first state, the resilien...