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cooling of a power component placed on a pcb

IP.com Disclosure Number: IPCOM000008937D
Publication Date: 2002-Jul-25
Document File: 1 page(s) / 32K

Publishing Venue

The IP.com Prior Art Database

Abstract

ID608113

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ID608113

Cooling of a power component placed on a PCB

   It is known to cool power components that are placed on a printed circuit board and comprise their own heat sink by connecting the heat sink directly or via a body, formed out of a material that has a high heat conductivity, to the printed circuit board. During operation the heat sink will will cool the component by absorbing the heat developed in it, while the the heat sink in turn transfers its heat to the printed circuit board. Although the cooling of the power component that is realized in that way is generally satisfactory, there are practical situations in which it is desirable to relize the cooling of the power component in a different way. Reference is made to the figure.

   The figure shows that the component is in contact with a first printed circuit board PCB with one of its sides. Where necessary the component can be glued to the printed circuit board. The heat sink comprised in the component is facing away from the printed circuit board PCB and is in contact with another heat sink (the extra heat sink) formed by a piece of metal or a second printed circuit board. The first printed circuit board PCB and the second printed circuit board can be part of the same electronic circuit. In that case for instance components that are not heat sensitive can be placed on the second printed circuit board and the second printed circuit board can be connected to the first printed circuit board by means of a connecto...