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Method for a high-density cap

IP.com Disclosure Number: IPCOM000008961D
Publication Date: 2002-Jul-26
Document File: 2 page(s) / 82K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a high-density cap. Benefits include improved capacitance.

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Method for a high-density cap

Disclosed is a method for a high-density cap. Benefits include improved capacitance.

Background

              A requirement exists to improve the capacitance value of a cap for a given case size. The conventional solutions are to use a larger capacitor case size or increase the number of electrodes (see Figure 1).

General description

              The disclosed method is a design to increase the capacitance density of a cap for a given case size. The key element of the method is to use a nonflat electrode surface design to increase the total surface area of electrode plates, increasing the capacitance of the part (see Figure 2).

Advantages

              The disclosed method provides advantages, including:

·        Improved (smaller) case size capacitor to achieve the same capacitor value

·        Improved capacitance value of a cap for a given case size by increasing the total surface area of the electrodes

Detailed description

              The disclosed method is a design that increases the capacitance density of a cap. The process to produce the disclosed method is comprised of the following steps:

1.      The first dielectric layer is etched using mechanical or chemical etching to create hills and valleys (main feature of this design to increase overall surface area).

2.      Electro-deposition or the vapor deposition method places a thin layer of electrode on the dielectric.

3.      If baking is required, it is done at this stage

4.      Via formation, option 1: Vias are created as each cap layer is built using either mechanical...