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Method for 10/100BaseT and 1000BaseT RJ45 modular jacks with identical mechanical and electrical layouts

IP.com Disclosure Number: IPCOM000008962D
Publication Date: 2002-Jul-26
Document File: 5 page(s) / 305K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for 10/100BaseT and 1000BaseT RJ45 modular jacks with identical mechanical and electrical layouts. Benefits include improved functionality, an improved design environment, and improved product lead time.

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Method for 10/100BaseT and 1000BaseT RJ45 modular jacks with identical mechanical and electrical layouts

Disclosed is a method for 10/100BaseT and 1000BaseT RJ45 modular jacks with identical mechanical and electrical layouts. Benefits include improved functionality, an improved design environment, and improved product lead time.

Background

      Multiple printed circuit board (PCB) designs are fabricated to accommodate the different feature sets within a product family. Examples include 2X USB, 10/100BaseT (see Figure 1), or 1000BaseT (see Figure 2) modular jacks.

Description

      The disclosed method is a design for 10/100BaseT and 1000BaseT RJ45 modular jacks. It has an identical electrical traces (see Figure 3) and mechanical layout (see Figure 4) to the existing 1000BaseT RJ45, which includes:

·        Identical USB, RJ45, and LED lead location

·        Identical PCB electrical trace termination locations and lead-to-lead spacing
(see Figure 5)

·        Identical USB shield and overall shield finger location

·        Identical finger-to-finger spacing

      The consistent design between the two different speed LAN connectors enables the inclusion of either a 2X USB, 10/100BaseT modular jack, or 1000BaseT modular jack into a single PCB enabling multiple feature sets without the redesign and fabrication of new PCBs.

Advantages

              The disclosed method provides advantages, including:

·        Improved functionality of the integration of multiple-speed LAN connectors with a 2X USB connector on one PCB

·        Improved cost effectivenes...