Browse Prior Art Database

Method for a printed circuit manufacturing apparatus for improved component power delivery for high-power logic devices

IP.com Disclosure Number: IPCOM000008968D
Publication Date: 2002-Jul-26
Document File: 4 page(s) / 115K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a printed circuit manufacturing apparatus for improved component power delivery for high-power logic devices. Benefits include improved power performance, improved thermal performance, and improved reliability.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Method for a printed circuit manufacturing apparatus for improved component power delivery for high-power logic devices

Disclosed is a method for a printed circuit manufacturing apparatus for improved component power delivery for high-power logic devices. Benefits include improved power performance, improved thermal performance, and improved reliability.

Background

              On high-power logic devices, power, ground, and I/O connections are made through the PCB by means of vias that limit the delivery of current to the part.

              As demands on power delivery increase, development of higher-performance logic silicon products must keep pace. The higher currents of low voltage power-delivery designs are required to meet CPU performance demands. One potential bottleneck is the delivery of power to the component transmitted through micro-vias (small plated through-holes) between layers in the printed circuit board (PCB).

              The conventional method of PCB via interconnection has a relatively low volume of solder and other plated metalization, limiting current to the component (see Figure 1). The high current density can result in excessive ohmic/self-heating, which increases the PCB temperature. Better power delivery can often lead to less power/ground contacts, which can reduce package size and increase board density.

                            PCBs continue to be processed through the conventional process, including solder mask, silkscreen, and plating finishes. Because of the small diameter of the vias and the depth and thermal mass of the PCB, cooling of the wicking solder prevents 10...