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Barrier Protected Pin-less CPU

IP.com Disclosure Number: IPCOM000008973D
Publication Date: 2002-Jul-26
Document File: 2 page(s) / 69K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses gold-plated pads and a spring loaded pinned socket to replace the pins that connect to the motherboard of a CPU. Benefits include a reduction in damaged pins and returned materials.

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Barrier Protected Pin-less CPU

Disclosed is a method that uses gold-plated pads and a spring loaded pinned socket to replace the pins that connect to the motherboard of a CPU. Benefits include a reduction in damaged pins and returned materials.

Background

Currently, pins and a pinned socket are used to connect to a CPU. Because pins are delicate and easily damaged, production relies heavily on technician training and ESD preventive measures to ensure that pins are not damaged; however, technician turnover and a high-volume manufacturing environment make it difficult to ensure quality. Additionally, with each generation of CPUs it is more difficult to produce ESD protective structures on the die. Smaller devices and thinner oxides on the input circuits also become more susceptible to voltage spikes.

General Description

In the disclosed method, gold-plated pads replace the pins normally found on the CPU interposer (see Figure 1). The pads are the contacts that a pinned socket on a motherboard uses to connect to the CPU. Figure 2 shows examples of spring-loaded pin designs for the pin-less CPU. An insulating barrier (of the same material as the interposer) is joined to the interposer. The barrier contains holes that enable the pins on a socket to come in contact with the pads, but is thicker from the bottom of the package to the lands, thereby protecting the CPU from materials with a thicker width than the pins.

Advantages

The following are advantages of the disclosed method:

 

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