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Method for equipment for folding of tape substrate semiconductor packages

IP.com Disclosure Number: IPCOM000008975D
Publication Date: 2002-Jul-26
Document File: 8 page(s) / 701K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for equipment for folding of tape substrate semiconductor packages. Benefits include improved functionality and improved throughput.

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Method for equipment for folding of tape substrate semiconductor packages

Disclosed is a method for equipment for folding of tape substrate semiconductor packages. Benefits include improved functionality and improved throughput.

Background

      No conventional method/equipment exists to fold thin substrates for a folded stack ball grid array (BGA). Some of the folding equipment used for folded-stack-micro-BGA requires precise movement of the equipment components to achieve the required folding process and accuracy (see Figure 1).

              The equipment has three legs for folding substrates at two locations. The middle leg is stationary. As can be seen, the packages to be folded are placed in appropriate slots on one side. After placement of the packages, one of the legs is activated. The two legs are connected by mechanical hinges and when one of the legs is activated, it achieves folding process (see Figure 2). Two chucks, chuck A and chuck B, can be vacuum assisted to hold the substrates in position during folding process. After the substrate is secured (see Figure 3), one of the chucks rotates 180 degrees and achieves the fold. This process requires accurate movement of the chucks to achieve the desired folding process without damaging the thin substrate. Accurate control of chuck position, acceleration, and clamping force are required in this procedure. This process cannot be easily adjusted or converted for package variations.

              Other conventional equipment based on kinematic linkages, such as hinges or mechanical fingers, do not ensure positive position of the package being folded. The folding dimensions involved with the folded stack BGA are smaller than other existing packages. Whether technology based on a conventional equipment set would work for the new process is not yet known.

General description

      The disclosed method is an equipment to fold tape substrate semiconductor packages for folded stack ball grid array (FSBGA). The key elements of the method include:

·        A special shaped fixture for folding tape substrate used in FSBGA

·        The equipment has fewer moving parts as compared to conventional technology, making the folding process less complicated and more accurate.

·        The equipment does not require vacuum chucks to hold substrate in place.

·        The equipment can be used to fold the entire strip containing many packages at the same time.

·        Heating elements in the fixture cure the adh...