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WAFER FRAME DEVELOPMENT FOR TWO-DIRECTIONAL WAFER LOADING IN X-CELL DIE BONDING

IP.com Disclosure Number: IPCOM000009035D
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Aug-02
Document File: 2 page(s) / 149K

Publishing Venue

Motorola

Related People

Chang D.W: AUTHOR [+3]

Abstract

Because of the acceleration sensing die char- acteristics, X-lateral accelerometer wafer is fahri- cated with the crossed mask unlike other general wafer (showed in Figure 1) during its manufactur- ing process. The current die bond machine in X -lateral was designed for picking and bonding the general pattern die not the crossed (reversed) pattern die. Therefore, operators have to do parame- ter setting twice per one wafer die bonding in order to pick the crossed pattern dice of X-cell wafer (the reversed dice).

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Technical Developments

WAFER FRAME DEVELOPMENT FOR TWO-DIRECTIONAL WAFER LOADING IN X-CELL DIE BONDING

by Chang D.W, Kim K.M and Park David

BACKGROUND

  Because of the acceleration sensing die char- acteristics, X-lateral accelerometer wafer is fahri- cated with the crossed mask unlike other general wafer (showed in Figure 1) during its manufactur- ing process. The current die bond machine in X -lateral was designed for picking and bonding the general pattern die not the crossed (reversed) pattern die. Therefore, operators have to do parame- ter setting twice per one wafer die bonding in order to pick the crossed pattern dice of X-cell wafer (the reversed dice).

PROBLEM DESCRIPTION

  To perform accelerometer wafer die bonding with current X-lateral bond machine, additional parameter setting is needed to pick the reversed dice. For example, P.R reconfiguration, Pick-up tip recentering, Bond 'Y' position readjustment, etc.

INVENTION

  To eliminate those additional process at X-lat- eral die bond process, two directional wafer loading technology is needed instead of one directional wafer loading method in current use. To modify

the die bond process as two directional wafer loading, snipped out the wafer frame in symmet- ric shown in Figure 2, so that the frame secure two directional mark to be guided by wafer table in the die bonder. (In case of one directional wafer loading, one side snipping as guide mark is enough.) So, the die bond can achieve high pro- ducti...