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IDEAL LEAD FRAME (IDL) FOR THE BUMP CHIP CARRIER (BCC) USING THE VARIABLE/INCREMENTAL SUBSTRATE NESTING (VISN) METHODOLOGY

IP.com Disclosure Number: IPCOM000009038D
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Aug-02
Document File: 3 page(s) / 235K

Publishing Venue

Motorola

Related People

Pat Crawford: AUTHOR [+4]

Abstract

The Ideal Lead Frame (IDL) for the Bump Chip Carrier (BCC) using the Variable/Incremental Substrate Nesting (VISN) methodology provides a single leadframe design that can be used for many different combinations of I/O pin counts and pack- age sizes. This approach accepts a wide range of die sizes on a single design (including rectangular die and varying aspect ratios). It also allows wire bond- ing location flexibility, and can shorten wire lengths for improved electrical performance, which reduces wire sweep. Overall improvements of the 'one-size- fits-all' lead frame are simplified inventory manage- ment; which can result in reduced cost, and reduced cycletime for this approach.

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Technical Developments

IDEAL LEAD FRAME (IDL) FOR THE BUMP CHIP ~CARRIER (BCC) USING THE VARIABLE/INCREMENTAL SUBSTRATE NESTING

(VISN) METHODOLOGY ~

by Pat Crawford, Dwight Daniels, Jeffrey Alan Miks and Dilip Pate1

ABSTRACT

  The Ideal Lead Frame (IDL) for the Bump Chip Carrier (BCC) using the Variable/Incremental Substrate Nesting (VISN) methodology provides a single leadframe design that can be used for many different combinations of I/O pin counts and pack- age sizes. This approach accepts a wide range of die sizes on a single design (including rectangular die and varying aspect ratios). It also allows wire bond- ing location flexibility, and can shorten wire lengths for improved electrical performance, which reduces wire sweep. Overall improvements of the 'one-size- fits-all' lead frame are simplified inventory manage- ment; which can result in reduced cost, and reduced cycletime for this approach.

PROBLEM

  The purpose of this invention is to provide a sin- gle leadframe design that can be used for many dif- ferent combinations of I/O pin counts and package size in the BCC package platform. This invention allows for maximum die size flexibility within a sin- gle Leadframe BCC design. This approach allows for variable wirebond sites along the length of each wire bond finger/lead.

SOLUTION

  This invention combines three known inven- tions: 1) the BCC package technology - this inven- tion uses the BCC as the packaging platform; 2)

IDL technology - this invention uses the lead frame technology from IDL (i.e. uses a leadframe without a flag); 3) VISN technology - this invention uses multiple wire bond locat...