Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

FLEXIBLE CONDUCTIVE SHIELD

IP.com Disclosure Number: IPCOM000009273D
Original Publication Date: 1999-Jun-01
Included in the Prior Art Database: 2002-Aug-14
Document File: 2 page(s) / 101K

Publishing Venue

Motorola

Related People

Brian Daniel: AUTHOR [+4]

Abstract

The invention was created in response to the need for lightweight, low cost electromagnetic shielding in a space electronics application. The closest known technology is the standard metal lid that is attached to the chassis with screws. An alter- native technology is a conductive fabric/foil shield attached to the frame/chassis with clips.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 50% of the total text.

Page 1 of 2

Developments Technical 0 M MO-LA

FLEXIBLE CONDUCTIVE SHIELD

by Brian Daniel, William Haber, Joseph Chott and Gabriel De Santos

WHAT IS THE PROBLEM?

  The invention was created in response to the need for lightweight, low cost electromagnetic shielding in a space electronics application. The closest known technology is the standard metal lid that is attached to the chassis with screws. An alter- native technology is a conductive fabric/foil shield attached to the frame/chassis with clips.

WHAT IS THE PARTICULAR SOLUTION TO THE PROBLEM?

  In a large space system, the weight of EMI shield covers for 20+ modules can become an unac- ceptable weight impact. The flexible conductive shield provides electromagnetic shielding in a light- weight package that is easy and fast to install. This shielding invention reduces electromagnetic emis- sions and improves hardware immunity to external electromagnetic emissions in a lightweight, low cost, and easy to install and remove package.

HOW DOES THE DISCLOSED STRUCTURE WORK?

  This invention is a simple method of adding conductive shielding (top, bottom and/or sides) to a

chassis or module. Refer to the Figure 1 for a description of the flexible conductive shielding process.

  The conductive foil or flexible material will pro- vide electromagnetic field attenuation virtually any- where a shield is required. The conductive material will provide RF shielding for spacecraft subassem- blies in a space environment, rack-mount subassem- blies in buildings, as well as subassemblies in auto- mobiles, ships, aircraft and other fixed or mobile applications.

  Optional insulating material layer(s), bonded to the conductive shield material, can be used to pre- vent intermittent shield grounding, improve thermal properties of the shield, etc. The insulating material may be flexible or, if desired, it may add stiffness and puncture resistance...