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WAFER FRAME DEVELOPMENT FOR TWO-DIRECTIONAL WAFER LOADING IN X-CELL DIE BONDING

IP.com Disclosure Number: IPCOM000009276D
Original Publication Date: 1999-Jun-01
Included in the Prior Art Database: 2002-Aug-14
Document File: 2 page(s) / 135K

Publishing Venue

Motorola

Related People

Chang D.W.: AUTHOR [+3]

Abstract

Because of the acceleration sensing die charac- teristics, X-lateral accelerometer wafer is fabricated with the crossed mask unlike other general wafer (shown in Figure 1) during its manufacturing process. The current die bond machine in X-lateral was designed for picking and bonding the general pattern die not the crossed (reversed) pattern die. Therefore, operators have to do parameter setting twice per one wafer die bonding in order to pick the crossed pattern dice of X-cell wafer (the reversed dice).

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Developments Technical 0 M MO-LA

WAFER FRAME DEVELOPMENT FOR TWO-DIRECTIONAL

WAFER LOADING IN X-CELL DIE BONDING

by Chang D.W., Kim K.M. and Park David ~

BACKGROUND GRAPHICAL NARRATION

  Because of the acceleration sensing die charac- teristics, X-lateral accelerometer wafer is fabricated with the crossed mask unlike other general wafer (shown in Figure 1) during its manufacturing process. The current die bond machine in X-lateral was designed for picking and bonding the general pattern die not the crossed (reversed) pattern die. Therefore, operators have to do parameter setting twice per one wafer die bonding in order to pick the crossed pattern dice of X-cell wafer (the reversed dice).

PROBLEM DESCRIPTION

  To perform accelerometer wafer die bonding with current X-lateral bond machine, additional parameter setting is needed to pick the reversed dice. For example, P.R re-configuration, Pick-up tip recentering, Bond 'Y' position readjustment, etc.

INVENTION

  A two directional wafer loading method is need- ed to eliminate the additional processes during the X-lateral die bond process.

  To modify the die bond process as two direc- tional wafer loading, snip out the wafer frame in symmetric as illustrated in Figure 2 so that the frame secures two directional marks to be guided by wafer table in the die bonder. (In case of directional wafer loading, one side snipping as guide mark is enough.)

  So, the die bond can ~,achieve high productivity and eliminate the trivial parame...