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Method for an RMx with a folded-over liner

IP.com Disclosure Number: IPCOM000009278D
Publication Date: 2002-Aug-14
Document File: 2 page(s) / 1M

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an RMx with a folded-over liner. Benefits include improved product time to market.

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Method for an RMx with a folded-over liner

Disclosed is a method for an RMx with a folded-over liner. Benefits include improved product time to market.

Background

Conventional technology requires modification of the computer chassis for each processor chipset technology change.

Description

              The disclosed method is a double-sided adhesive to attach a processor mounting plate to another surface (see Figure 1). The adhesive is protected by a flexible liner material that has excess length to enable the liner to be folded under itself. In this configuration, the assembly can be place into its intended position while leaving the adhesive covered and protected by the liner. When the assembly is in final position, the liner is pulled under itself exposing the adhesive.

              Pull-tabs enable the motherboard to be placed and secured prior to adhesive exposure. The tabs would be longer than shown (see Figure 2) to ensure grip and enable multiple processor locations. The motherboard is placed into the chassis and screwed into position. The liner tab is pulled to expose the adhesive. Pressure is applied to ensure adhesive contact.

              The capability to expose the adhesive in this way is a key element of this design concept.

              The use of this method has not been implemented for processor thermal solutions.

Advantages

              Some implementations of the disclosed structure and method provide one or more of the following advantages:

·        Improved time to market d...