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Method for a retention fixture that applies a variable point load on the center of any heatsink base

IP.com Disclosure Number: IPCOM000009279D
Publication Date: 2002-Aug-14
Document File: 3 page(s) / 37K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a retention fixture that applies a variable point load on the center of any heatsink base. Benefits include improved thermal performance.

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Method for a retention fixture that applies a variable point load on the center of any heatsink base

Disclosed is a method for a retention fixture that applies a variable point load on the center of any heatsink base. Benefits include improved thermal performance.

Background

        � � � � � Poor thermal performance occurs to a semiconductor package due to tilting of the thermal solution (such as a heatsink). Tilting is caused by an uneven load. It occurs most frequently on bare-die semiconductor packages, which can be convex in shape. Hot spots result and affect the performance and life span of the package.

� � � � � Conventional retention devices apply a load on two or more sides of the heatsink. If the load is not applied uniformly, the heatsink can tilt, impacting the thermal performance of the package (see Figure 1).

� � � � � Point load is applied on a long plate directly over the heat source, such as a bare die or an integrated heat spreader (IHS). With the retention applied on the top surface of the plate and directly over the heat source, a heatsink must be placed on at least one side of the plate to remove heat. This method provides an effective point load source but requires additional space, which can be disadvantageous (see Figure 2).

        � � � � � Conventional point load retentions create obstructions that stop a heatsink from being placed directly over the heat source.

General description

        � � � � � The disclosed method is the retention of a heatsink directly over the heat source using a point-loaded source along the center of the heatsink over a range of loads.

        � � � � � The key elements of the method include:

·        The top plate of the retention goes over the top of any type of heatsink, and a load-bearing piece extends downward from it to apply a load to the heatsink base.

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