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Method for an integrated core stiffener for the internal mechanical support of flip-chip microelectronic packages

IP.com Disclosure Number: IPCOM000009284D
Publication Date: 2002-Aug-14
Document File: 4 page(s) / 100K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an integrated core stiffener for the internal mechanical support of flip-chip microelectronic packages. Benefits include equal or improved performance at reduced cost.

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Method for an integrated core stiffener for the internal mechanical support of flip-chip microelectronic packages

Disclosed is a method for an integrated core stiffener for the internal mechanical support of flip-chip microelectronic packages. Benefits include equal or improved performance at reduced cost.

Background

              Flip-chip packages using thinner cores such as metal-based or printed circuit board-type materials are more flexible and less robust mechanically (especially when under loading conditions) than thicker core counterparts.

              The conventional method for stiffening flip-chip packages is an external stiffener plate affixed post-assembly or the use of thicker core materials.

General description

              The disclosed method is an integrated stiffener used in flip-chip microelectronic package cores. The key elements of the method include:

·        Flip-chip microelectronic packages

·        Use of an integrated stiffener within the package core material

              An integrated stiffener can be designed into the core material with little or no impact on electrical performance and at minimal cost. This method is particularly advantageous with thin core packages where external stiffening is required and with metal-based core materials that can be routed or shaped during the etch steps typical of the conventional process. Using the disclosed method, external stiffener devices may not be required, reducing package cost. Via pitch and depth can also be maintained or i...