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Method for a pressure contact pin design

IP.com Disclosure Number: IPCOM000009289D
Publication Date: 2002-Aug-14
Document File: 2 page(s) / 75K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a pressure contact pin design. Benefits include improved thermal performance and improved performance.

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Method for a pressure contact pin design

Disclosed is a method for a pressure contact pin design. Benefits include improved thermal performance and improved performance.

Background

� � � � � Pressure contact pins that connect to a land grid array (LGA) require improved weight-absorbing characteristics from the heatsink assembly. The conventional method uses plastic and traditional pins.

        � � � � � The conventional design has limitations to the amount of stresses that can be absorbed from the vertical force from the heatsink assembly and heat dissipation (see Figure 1).

Description

        � � � � � The disclosed method is a pressure-contact pin design to aid in connector resistance and support forces created by the resting weight of the heatsink assembly that is above the LGA. The key elements of the method include:

·        Pin design

·        Pin material

        � � � � � For example, ribs are added to a connector pin to enable more force loading (see Figure 2).

A preferred material is beryllium copper because it dissipates heat far better than copper or lead.

Advantages

� � � � � The disclosed method provides advantages, including:

·        Improved thermal performance due to the capability to conduct heat away from the heatsink through the use of beryllium copper

·        Improved performance due to the capability to bear weight

·        Improved cost performance due the pins being in a roll form for the applications

Fig. 1

Fig. 2

Disclosed anonymously