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Method for the dense placement of surface mount components using adhesive film

IP.com Disclosure Number: IPCOM000009295D
Publication Date: 2002-Aug-14
Document File: 3 page(s) / 35K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the dense placement of surface mount components using adhesive film. Benefits include improved functionality and improved ease of manufacturing.

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Method for the dense placement of surface mount components using adhesive film

Disclosed is a method for the dense placement of surface mount components using adhesive film. Benefits include improved functionality and improved ease of manufacturing.

Background[IC1] 

        � � � � � In conventional microelectronic packages, discrete components (including capacitors, resistors and inductors) are often placed on the substrate. Because of the limitations of available manufacturing equipment and methods, it is sometimes not possible to place enough components in the space available.

These components are placed one by one on the substrate, so throughput could be improved if a method were available to place them all at once.

[IC2] 

General description

        � � � � � The disclosed method places surface mount components at a unit-per-area density exceeding that which conventional pick-and-place methods and equipment can attain. The components are arranged, attached to an adhesive film or plate, and placed as a single unit.

        � � � � � The key elements of the method include:

•        � � � � Prearrangement of many components for placement

•        � � � � Freezing that arrangement using an adhesive film

•        � � � � Placement of many components as one block unit, instead of one by one

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved functionality due to very dense component placement, which results in the following:

        � � � � � -        � � � � Better electrical performance, as more components can be fit into any given space.

        � � � � � -        � � � � Denser component placement, which can enable:

                � � � � � � � � � � � ◊        � � � smaller substrates

                � � � � � � � � �...