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Method for the use of reverse copper dot meshing on MMAP strips to minimize warpage on thin-core substrates

IP.com Disclosure Number: IPCOM000009297D
Publication Date: 2002-Aug-14
Document File: 2 page(s) / 134K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the use of reverse copper dot meshing on molded matrix array package (MMAP) strips to minimize warpage on thin core substrates (less than or equal to 100 µm). Benefits include improved reliability.

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Method for the use of reverse copper dot meshing on MMAP strips to minimize warpage on thin-core substrates

Disclosed is a method for the use of reverse copper dot meshing on molded matrix array package (MMAP) strips to minimize warpage on thin core substrates (less than or equal to 100 µm). Benefits include improved reliability.

Background

              Molded matrix array package (MMAP) strip warpage occurs as core material thickness drops below 100 µm. Thin-core material is a recently defined requirement. Conventional requirements are met using conventional meshing (see Figure 1).

General description

              The disclosed method uses reverse copper meshing to minimize strip warpage as core thickness decreases to meet customer requirements for thinner packages.

              Meshing is applied; that is, solid copper is etched away in a meshing pattern to provide better adhesion for soldermask to base core material. Reverse meshing starts with 100% base core material and adds copper dots. This approach eliminates additional copper in nonworking areas of the strip that can cause warpage in the strip after baking due to coefficient of thermal expansion (CTE) mismatch. The disclosed design also provides greater soldermask adhesion to base copper.

Advantages

              The disclosed method provides advantages including

•             Improved reliability due to improved soldermask adhesion to the MMAP strip

•             Improved reliability due to minimized strip warpage for thinner cor...