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RF CONNECTOR STRAIN RELIEF

IP.com Disclosure Number: IPCOM000009304D
Original Publication Date: 1999-Jun-01
Included in the Prior Art Database: 2002-Aug-15
Document File: 3 page(s) / 111K

Publishing Venue

Motorola

Related People

S. Pronto: AUTHOR [+2]

Abstract

The development of the method for strain reliev- ing RF connectors described here was driven by reliability concerns. Few "off the shelf' connectors exist today that provide strain relief at the interface between RF connector center conductors, and the circuits they interconnect to. The concept described in this paper was developed for a type "N" connec- tor, however the approach could be adapted to most RF connector styles.

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MOTOROLA Technical Developments

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RF CONNECTOR STRAIN RELIEF

by S. Pronto and P. Steder

INTRODUCTION

  The development of the method for strain reliev- ing RF connectors described here was driven by reliability concerns. Few "off the shelf' connectors exist today that provide strain relief at the interface between RF connector center conductors, and the circuits they interconnect to. The concept described in this paper was developed for a type "N" connec- tor, however the approach could be adapted to most RF connector styles.

  The practice of directly soldering an RF comrec- tor center conductor to a printed circuit board is efft-

cient, and inexpensive. However, the resulting sol- der joint interface is subject to a number of stresses. The center conductor may stress the solder joint, when the mating connector is assembled. The joint may be assembled with a built in stress, or a high resistance solder bridge, depending on the tolerance stack-up between the connector and the printed cir- cuit board mounting planes. The solder joint may also be subjected stress caused by thermal cycling. The potential for thermal stress damage to RF con- nector solder joints increases with increasing RF power levels, as does the subsequent damage to the cotmector and printed circuit board.

RF Connector Strain Relief

Solder Joint. Zone 3

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Fig. 1

zone is the strain relief, composed in the simplest form, of a single moderate radius "Omega" bend in the stock. This strain relief zone can be formed with two bends, if strain relief is required in three dimen- sions (Figure 4). The inner surface of the strain relief bend can be laminated with a metal such as aluminum to prevent solder bridging. The third zone is the interface to the printed circuit trace, and will generally be a flat tab. Additional embodiments ilhtstrate alternate interconnect approaches.

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