Browse Prior Art Database

MULTI CHIP DIE BONDER WITH WAFER POSITIONING STAGE OPERATING SOFTWARE

IP.com Disclosure Number: IPCOM000009420D
Original Publication Date: 1999-Sep-01
Included in the Prior Art Database: 2002-Aug-22
Document File: 2 page(s) / 92K

Publishing Venue

Motorola

Related People

Brian T. Albrecht: AUTHOR [+2]

Abstract

The current eutectic die attach procedure for RF devices on the Multi Chip Die Bonder is a very time- consuming and tedious process. A majority of the process is performed manually by an operator. Since operations performed by the operator are sequential, throughput is low and variable based on operator skill. It would be beneficial to automate the critical operations to improve quality and increase parallel operations.

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Developments Technical 0 M MO-LA

        MULTI CHIP DIE BONDER WITH WAFER POSITIONING STAGE OPERATING SOFTWARE

by Brian T. Albrecht and Mike Eleff

BACKGROUND

  The current eutectic die attach procedure for RF devices on the Multi Chip Die Bonder is a very time- consuming and tedious process. A majority of the process is performed manually by an operator. Since operations performed by the operator are sequential, throughput is low and variable based on operator skill. It would be beneficial to automate the critical operations to improve quality and increase parallel operations.

PROBLEM

  The Multi Chip Die Bonder is dependent on the operator to perform the location, alignment, and inspection of the die prior to pickup by the bond head. This process is very labor intensive and could lead to quality issues produced by the operator on the finished product. Device management, changeover and setup is difficult since each device has to be manually loaded into the system controller. To change setup parameters, the device program has to be edited and reloaded on the controller. Device programs control the pickup and bonding processes for the machine, but each process is performed serially.

SOLUTION

  A new process was developed that incorporated an automated wafer positioning stage and multi- tasking system controller. Combination of the stage and system controller allowed the process to max- mize the parallel actions performed by the machine

and operator (see Figure 1). Performing operations in parallel increased throughput by more than 100%. Commercial die bond equipment as well as the pre- vious Multi Chip Die Bonder performed each process in series, which leads to long cycle ti...