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Method and device for robust, vertical attachment of fragile components to a substrate

IP.com Disclosure Number: IPCOM000009480D
Publication Date: 2002-Aug-27
Document File: 3 page(s) / 82K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method and device for robust, vertical attachment of fragile components to a substrate. Benefits include improved prevention of defects and improved simplicity of manufacturing.

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Method and device for robust, vertical attachment of fragile components to a substrate

Disclosed is a method and device for robust, vertical attachment of fragile components to a substrate. Benefits include improved prevention of defects and improved simplicity of manufacturing.

Background

        � � � � � � Damage to components with delicate leads occurs during assembly and/or handling of assembled products. Conventionally, the crystal component is assembled to a substrate in a horizontal position, which is low cost and stable (Figure 1).� However, damage is frequent due to the stress imparted to the glass seal, at the bottom of the component, when the leads are bent.� The result is returned product and rework.

        � � � � � Alternately, vertically mounted components (crystals) are used, assembled into a socket, which is itself attached to the substrate (Figure 2).� However, these can be bent over due to rough or inattentive handling, breaking the component seals, allowing air infiltration, and rendering the part and product defective. As a result, a requirement has been identified that a new solution must be developed and implemented in order to minimize incidents of component damage.

        � � � � � Surface mount crystal packages are available but cost 4-5 times more than the leaded crystal packages.

General description

        � � � � � The disclosed method uses a device for attaching fragile components to printed circuit boards (PCBs), protecting their leads from damage due to assembly stresses and/or handling trauma.

        � � � � � The key elements of the method include:

·        Receptacles that attach the component to the substrate and protect it from handling damage

·        Insulated component sleeves, into which the component is inserted and which protect the leads from shorting together or to the receptacle

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved prevention of defects due to being extremely resistant to damage due to handling

•        � � � � Improved simplicity of manufacturing and of assembly onto the substrate

Detailed description

        � � � � � The disclosed method uses a device for attaching fragile components to PCBs. The method is comprised of two parts, the receptacle and the insulated component sleeve (see Figure 3).

•        � � � � R...