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Method and device for robust, vertical attachment of fragile components to a substrate

IP.com Disclosure Number: IPCOM000009480D
Publication Date: 2002-Aug-27
Document File: 3 page(s) / 105K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method and device for robust, vertical attachment of fragile components to a substrate. Benefits include improved prevention of defects and improved simplicity of manufacturing.

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Method and device for robust, vertical attachment of fragile components to a substrate

Disclosed is a method and device for robust, vertical attachment of fragile components to a substrate. Benefits include improved prevention of defects and improved simplicity of manufacturing.

Background

               Damage to components with delicate leads occurs during assembly and/or handling of assembled products. Conventionally, the crystal component is assembled to a substrate in a horizontal position, which is low cost and stable (Figure 1).  However, damage is frequent due to the stress imparted to the glass seal, at the bottom of the component, when the leads are bent.  The result is returned product and rework.

              Alternately, vertically mounted components (crystals) are used, assembled into a socket, which is itself attached to the substrate (Figure 2).  However, these can be bent over due to rough or inattentive handling, breaking the component seals, allowing air infiltration, and rendering the part and product defective. As a result, a requirement has been identified that a new solution must be developed and implemented in order to minimize incidents of component damage.

              Surface mount crystal packages are available but cost 4-5 times more than the leaded crystal packages.

General description

              The disclosed method uses a device for attaching fragile components to printed circuit boards (PCBs), protecting their leads from damage due to assembly stresses and/or handling trauma.

              The key elements of the method include:

·        Receptacles that attach the component to the substrate and protect it from handling damage

·        Insulated component sleeves, into which the component is inserted and which protect the leads from shorting together or to the receptacle

Advantages

              The disclosed method provides advantages, including:

•             Improved prevention of defects due to being extremely resistant to damage due to handling

•             Improved simplicity of manufacturing and of assembly onto the substrate

Detailed description

              The disclosed method uses a device for attaching fragile components to PCBs. The method is comprised of two parts, the receptacle and the insulated component sleeve (see Figure 3).

•             R...